Epoxy compounds for electronic application
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Epoxy Electronic Potting Product Sheet


Application One/ two components Curing condition Product name Features TDS Download
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Potting Two RT curing 5419A/B Clear. 5419A/B 5419A/B
Two RT curing 5250A/B Black. 5250A/B 5250A/B
Two RT curing 5433A/B Low coefficient of thermal expansion. 5433A/B 5433A/B
Two Heat curing 5086A/B Black color and high Tg. 5086A/B 5086A/B
Adhesive One Heat curing 2089, 2095, 2066 The minimum shrinkage. 2089, 2095, 2066 2089, 2095, 2066
One Heat curing 2070-1, 2073, 2074 High thermal conductivity,recommended for adhesion on various electronic parts. 2070-1, 2073, 2074 2070-1, 2073, 2074
Two RT curing 2500A/B Fast curing. 2500A/B 2500A/B
Impregnation Two Heat curing 5669A/B Low viscosity. 5669A/B 5669A/B
Flame-resistant     5350A/B, 5339A/B, 5073A/B, 5335A/B, 5007A/B, 5370A/B, 5014A/B, 5339-1A/B, 2080, 5351 A/B UL Recognized Component (UL94 V-0.5VA) UL information