Ink Application
Epoxy Ink
Description:
Epoxy Ink is suitable for wafer coating with good shelter, chemical resistance, and adhesion.
Product Application:
Touch panel industry, PCB, chip resistor, inductance, IC, D-RAM cover coat, and so on.
Description:
Epoxy Ink is suitable for wafer coating with good shelter, chemical resistance, and adhesion.
Product Application:
Touch panel industry, PCB, chip resistor, inductance, IC, D-RAM cover coat, and so on.
Product Sheet
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| Application | Type | One/ Two Components | Curing Condition | Product Name | Features | TDS Download | |
| Chinese | English | ||||||
| Epoxy Ink | Insulation | One | Heat curing | EI-300 series | Recommended for chip insulating ink. | EI-346-040 | EI-346-040 |
| Coverage | One | Heat curing | EI-900 series | Recommended for remarking ink. | EI-988-1 | EI-988-1 | |
| Marking | One | Heat curing | EI-M series | Recommended for marking ink. | EI-M series | EI-M series | |
| Ink application special resin | Cover | One | Heat curing | SI series | High temperature curing products are not yellowing with high gloss, L value of up to 90, hardness to 6H, and can wear 350 back. | SI series | SI series |
| Light guide ink | One | UV curing | UAG-63001(Vice Agent) UAG-64001(Main Agent) |
Excellent high brightness and low color difference. | UAG-63001 UAG-64001 | UAG-63001 UAG-64001 | |
| Solderable ink | One | UV curing | UHC-37002AB | High whiteness, gloss, hardness(>3H) and very low yellowing. | UHC-37002AB | UHC-37002AB | |